Display substrate, method of manufacturing the same and method of manufacturing display panel

ABSTRACT

In a method of manufacturing a display substrate and a method of manufacturing a display panel, the display substrate includes a color filter layer disposed on a base substrate within a pixel area, a first organic insulating pattern disposed on a first boundary area between adjacent pixel areas, a pixel electrode disposed on the color filter layer, and a first blocking pattern disposed on the first organic insulating pattern. Accordingly, an organic insulating layer corresponding to the pixel area is removed so that deterioration of the display quality by impurities generated from the organic insulating layer may be minimized. In addition, a stepped portion of a blocking pattern disposed between a pixel area and a boundary area of a plurality of the pixel areas is reduced so that motion blurring of a liquid crystal may be prevented.

CROSS REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 2009-0102083, filed on Oct. 27, 2009, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Exemplary embodiments of the present invention relate to a displaysubstrate, a method of manufacturing the display substrate, and a methodof manufacturing a display panel. More particularly, exemplaryembodiments of the present invention relate to a display substrateimproving display quality, a method of manufacturing the displaysubstrate, and a method of is manufacturing a display panel.

2. Discussion of the Background

Generally, a liquid crystal display device includes a liquid crystaldisplay panel displaying an image by using the light transmittance of aliquid crystal layer and a backlight assembly disposed under the liquidcrystal display panel to provide the liquid crystal display panel withlight. The liquid crystal display panel includes an array substrate, acolor filter substrate facing the array substrate and a liquid crystallayer interposed between the array substrate and the color filtersubstrate.

Recently, a color filter on array (COA) structure and a black matrix onarray (BOA) structure have been reported. In the COA structure, a colorfilter is formed on the array substrate. In the BOA structure, a colorfilter and a black matrix are formed on the array substrate. Accordingto the COA structure or the BOA structure, it is not required toconsider an alignment margin for an upper substrate so an aperture ratioof a pixel may be increased. Moreover, a structure of the uppersubstrate is simple so that manufacturing costs may be reduced.

Recently, a low-dielectric organic thin film is used as a protectinglayer or an insulating layer of a thin-film transistor for the liquidcrystal display device, so that image quality and an aperture ratio maybe improved by reducing parasitic capacitance. However, since the colorfilter or the black matrix is formed on the array substrate, a steppedportion between the color filter and the black matrix causes a motionblur malfunction of a liquid crystal display. In addition, when anorganic insulating layer is exposed to ultraviolet (UV) radiation,impurities (for example, gases that are generated from the decompositionof the organic insulating layer) may cause display qualitydeterioration.

SUMMARY OF THE INVENTION

Exemplary embodiments of the present invention provide a substrate forimproving display quality.

Exemplary embodiments of the present invention also provide a substratehaving an organic insulating layer corresponding to a pixel area that isremoved to minimize deterioration of display quality by impuritiesgenerated from the organic insulating layer. In addition, a steppedportion of a blocking pattern formed between a pixel area and a boundaryarea of a plurality of the pixel areas is reduced so that motionblurring of a liquid crystal may be prevented.

Additional features of the invention will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention.

An exemplary embodiment of the present invention discloses a displaysubstrate comprising a color filter layer disposed on a substrate andwithin a pixel area; a first organic insulating pattern disposed on thesubstrate in a position corresponding to a first boundary area betweenadjacent pixel areas; a pixel electrode disposed on the color filterlayer; and a first blocking pattern disposed on the first organicinsulating pattern.

An exemplary embodiment of the present invention also discloses a methodof manufacturing a display substrate that comprises forming a colorfilter layer on a substrate and within a pixel area, the substratecomprising a switching element; forming an organic insulating layer onthe substrate comprising the color filter layer; forming a first organicinsulating pattern by removing the organic insulating layer from an areacorresponding to the color filter layer and is removing a partialthickness of the organic insulating layer from a first boundary area inthe pixel area; forming a pixel electrode on the substrate, the pixelelectrode being electrically connected to the switching element; forminga first blocking pattern on the first organic insulating pattern; andforming a column spacer on the color filter layer.

An exemplary embodiment of the present invention further discloses amethod of manufacturing a display panel that comprises providing a firstsubstrate. The first substrate comprises a color filter layer disposedon the first substrate and within a pixel area, the first substratecomprising a switching element; an organic insulating layer disposed onthe color filter layer; a pixel electrode electrically connected to theswitching element; and a first blocking pattern disposed in a boundaryarea between adjacent pixel electrodes. The method further comprisesproviding a second substrate comprising a common electrode disposed on asecond base substrate; interposing a liquid crystal composition betweenthe first substrate and the second substrate; and irradiating the firstsubstrate and the second substrate with light to form a first reactivemesogen layer on the first substrate and a second reactive mesogen layeron the second substrate, wherein the liquid crystal compositioncomprises a reactive mesogen comprising at least one compound selectedfrom the group consisting of

wherein R1 and R2 independently represent an acrylate group, a vinylgroup, or an epoxy group; Y represents —(CH2)-, —O—, —CO—, —C(CF3)2-, ora single bond; X1, X2, X3, and X4 independently represent H or F; and nrepresents an integer ranging from 0 to 2.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention, andtogether with the description serve to explain the principles of theinvention.

FIG. 1 is a plan view showing a display panel according to an exemplaryembodiment of the present invention.

FIG. 2 is a cross-sectional view taken along a line I-I′ of the displaypanel of FIG. 1.

FIGS. 3A, 3B, 3C, 3D, 3E, 3F, and 3G are cross-sectional views showing aprocess for forming a first substrate of FIG. 2.

FIG. 4 is a cross-sectional view showing a process for forming a secondsubstrate of FIG. 2.

FIGS. 5A, 5B, and 5C are cross-sectional views showing a process forforming is the display panel of FIG. 2.

FIG. 6 is a plan view showing a display panel according to anotherexemplary embodiment of the present invention.

FIG. 7 is a cross-sectional view taken along a line II-II′ of thedisplay panel of FIG. 6.

FIGS. 8A, 8B, and 8C are cross-sectional views showing a process forforming a first substrate of FIG. 7.

FIG. 9 is a cross-sectional view showing a display panel according toanother exemplary embodiment of the present invention.

FIGS. 10A and 10B are cross-sectional views showing a process forforming a first substrate of FIG. 9.

FIG. 11 is a cross-sectional view showing a display panel according toanother exemplary embodiment of the present invention.

FIGS. 12A and 12B are cross-sectional views showing a process forforming a first substrate of FIG. 11.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

The invention is described more fully hereinafter with reference to theaccompanying drawings, in which embodiments of the invention are shown.This invention may, however, be embodied in many different forms andshould not be construed as limited to the embodiments set forth herein.Rather, these embodiments are provided so that this disclosure isthorough, and will fully convey the scope of the invention to thoseskilled in the art. In the drawings, the size and relative sizes oflayers and regions may be exaggerated for clarity Like is referencenumerals in the drawings denote like elements.

It will be understood that when an element or layer is referred to asbeing “on” or “connected to” another element or layer, it can bedirectly on or directly connected to the other element or layer, orintervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on” or “directly connected to”another element or layer, there are no intervening elements or layerspresent.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularexample embodiments only and is not intended to be limiting of thepresent invention. As used herein, the singular forms “a,” “an” and“the” are intended to include the plural forms as well, unless thecontext clearly indicates otherwise. It will be further understood thatthe terms “comprises” and/or “comprising,” when used in thisspecification, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Example embodiments of the invention are described herein with referenceto cross-sectional illustrations that are schematic illustrations ofidealized example embodiments (and intermediate structures) of thepresent invention. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, example embodiments of thepresent invention should not be construed as limited to the particularshapes of regions illustrated herein but are to include deviations inshapes that result, for example, from manufacturing. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the actual shape of a region of a device andare not intended to limit the scope of the present invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

Hereinafter, the present invention will be explained in detail withreference to the accompanying drawings.

FIG. 1 is a plan view showing a display panel according to an exemplaryembodiment of the present invention. FIG. 2 is a cross-sectional viewtaken along a line I-I′ of the display panel of FIG. 1. Referring toFIGS. 1 and 2, the display panel includes a first substrate 100, asecond substrate 200, and a liquid crystal layer 300.

The first substrate 100 includes a gate line GLn, a data line DLm, astorage line STL, a first switching element SW1, a second switchingelement SW2, a third switching element SW3, a gate insulating layer 120,an active layer 130, a passivation layer 140, a color filter layer 150,an inorganic insulating layer 160, an organic insulating pattern 170, apixel electrode, a blocking pattern 190, and a column spacer 195; all ofwhich are formed on a first base substrate 101.

A first gate line GL1 and a second gate line GL2 are extended in a firstdirection. The second gate line GL2 is disposed adjacent to the firstgate line GL1. The first data line DL1 and the second data line DL2 areextended in a second direction crossing the first direction. The seconddata line DL2 is disposed adjacent to the first data line LD1.

The first switching element SW1 is adjacent to an area where the firstgate line GL1 and the first data line DL1 cross. A pixel area includes afirst sub-pixel area 111 and a second sub-pixel area 112. The firstswitching element SW1 is disposed on a boundary area between a firstpixel area and a second pixel area. A first gate electrode GE1 of thefirst switching element SW1 is connected to the first gate line GL1. Afirst source electrode SE1 is connected to the first data line DL1. Afirst sub-pixel electrode PE1 is electrically connected to a first drainelectrode DE1 through a first contact hole CNT1.

The second switching element SW2 is adjacent to an area where the firstgate line GL1 and the first data line DL1 cross. The first switchingelement SW1 is disposed on a boundary area between the first sub-pixelarea 111 and the second sub-pixel area 112. A second gate electrode GE2is connected to the first gate lines GL1. A second source electrode SE2of the second switching element SW2 is connected to the first data lineDL1 and the first source electrode SE1. A second sub-pixel electrode PE2is electrically connected to a second drain electrode DE2 through asecond contact hole CNT2. The second sub-pixel electrode PE2 is disposedon a second sub-pixel area 112 adjacent to the first sub-pixel area 111.

The third switching element SW3 is disposed adjacent to an area wherethe second gate line GL2 and the second data line DL2 cross. The thirdswitching element SW3 is disposed on a boundary area between the firstsub-pixel area 111 and the second sub-pixel area 112. A third gateelectrode GE3 of the third switching element SW3 is connected to thesecond gate line GL2. A third source electrode SE3 is connected to thefirst data line DL1 and the second drain electrode DE2. A third drainelectrode DE3 is connected to the storage line STL.

A first storage line STL1 partially overlaps with the first sub-pixelelectrode PE1, and surrounds the first sub-pixel area 111. A secondstorage line STL2 overlaps with the first and second data lines DL1 andDL2. The second storage line STL2 is electrically connected to the firststorage line STL1 through a third contact hole CNT3.

The gate insulating layer 120 and the passivation layer 140 are disposedbetween the first sub-pixel electrode PE1 and the first storage lineSTL1.

The third drain electrode DE3 of the third switching element SW3 isconnected to a first electrode 125 of a down capacitor Cdown. The firstelectrode 125 overlaps with the first storage line STL1. The firststorage line STL1 may be defined as a second electrode of the down iscapacitor Cdown.

The first switching element SW1 and the second switching element SW2 areturned on in response to a first gate signal applied to the first gateline GL1. The third switching element SW3 is turned on in response to asecond gate signal applied to the second gate line GL2. When the thirdswitching element SW3 is turned on, a data voltage charged through thesecond sub-pixel electrode is lowered by the down capacitor Cdown. Anarea having the first sub-pixel electrode PE1 may be defined as a highpixel HP of the display panel. An area having the second sub-pixelelectrode PE2 may be defined as a low pixel LP of the display panel.

The first sub-pixel electrode PE1 includes a first micro electrode 183a. The first micro electrodes 183 a may be branched from a first bodyportion 181 a that is extended in a first direction and a seconddirection in a cross shape. The first micro electrodes 183 have a radialshape. The second sub-pixel electrode PE2 includes a second microelectrode 183 b. The second micro electrodes 183 b may be branched froma second body portion 181 b having a cross shape. The second microelectrodes 183 b have a radial shape.

The gate insulating layer 120 is formed on the first base substrate 101having a gate pattern formed thereon. The gate pattern includes thefirst gate line GL1, the second gate lines GL2, the first gate electrodeGE1, the second electrode GE2, and the third gate electrode GE3. Thegate insulating layer 120 covers the gate pattern and the storage lineSTL.

The active layer 130 is formed on the gate insulating layer 120. Theactive layer 130 is an electric pathway of the switching element andincludes a semiconductor layer having amorphous silicon (s-Si:H) and anohmic contact layer having amorphous silicon doped with n-type dopants(n+s-Si:H) formed on the semiconductor layer.

A source pattern is formed on the first base substrate 101 having theactive layer 130 formed thereon. The source pattern includes the firstand the data lines DL1 and DL2, the first to the third source electrodesSE1, SE2 and SE3, and the first to the third drain electrodes DE1, DE2and DE3. The passivation layer 140 is formed on the first base substrate101 having the source pattern formed thereon.

The color filter layer 150 is formed on the first base substrate 101having the passivation layer 140 formed thereon. The color filter layer150 may be formed on the first sub-pixel area 111 and the secondsub-pixel area 112, which are defined by the first gate line GL1, thefirst data line DL1, the second gate line GL2, and the second data lineDL2. The color filter layer 150 may include a first color filter layer,a second color filter layer, and a third color filter layer. The firstto third color filter layers represent different colors. For example,the first color filter layer, the second color filter, and the thirdcolor filter may represent the colors red, blue, and green,respectively.

The inorganic insulating layer 160 is formed on the first base substrate101 having the color filter layer 150 formed thereon and may includesilicon nitride (SiN_(x)).

The organic insulating pattern 170 is formed on the inorganic insulatinglayer 160. A first organic insulating pattern is formed on the boundaryarea between the pixel areas. A second organic insulating pattern isformed on the boundary area between the first sub-pixel area 111(defined by the first gate line GL1 and the first data line DL1) and thesecond sub-pixel area 112 (defined by the second gate line GL2 and thesecond data line DL2). The first organic insulating pattern and thesecond organic insulating pattern may be referred to as the organicinsulating pattern 170 hereinafter. Since the organic insulating layercorresponding to the pixel area is removed, deterioration of the displayquality by impurities generated from the organic insulating layer causedby UV exposure may be minimized. Removing the organic insulating islayer does not require removal of all traces of the organic insulatinglayer.

The organic insulating pattern 170 planarizes a surface of the firstbase substrate 101 having the gate lines GLn, the data lines DLm, andthe switching element formed thereon. When a thickness of the organicinsulating pattern 170 is reduced on the boundary area between the firstsub-pixel area 111 and the second sub-pixel area 112, a stepped portionformed by a blocking pattern disposed between the first and the secondpixel areas and the boundary area of the first and second pixel areas isreduced so that a motion blurring of a liquid crystal may be prevented.

The first and second contact holes CNT1 and CNT2 exposing a portion ofthe first, the second, and the third drain electrodes DE1, DE2 and DE3are formed through the organic insulating pattern 170. The first andsecond sub-pixel electrodes PE1 and PE2 are formed on the organicinsulating layer 170 having the first and second contact holes CNT1 andCNT2 formed therethrough. The first and second sub-pixel electrodes PE1and PE2 may include an optically transparent and electrically conductivematerial and make contact with the first and second drain electrodes DE1and DE2 through the first and second contact holes CNT1 and CNT2,respectively. The optically transparent and electrically conductivematerial may include, for example, indium tin oxide (ITO) or indium zincoxide (IZO).

A first blocking pattern is formed on the boundary area of each pixelarea on the first base substrate 101. A second blocking pattern isformed on the boundary area between the first sub-pixel area 111 havingthe first pixel electrode PE1 and the second sub-pixel area 112 havingthe second sub-pixel electrodes PE2. The first blocking pattern and thesecond blocking pattern are referred to as the blocking pattern 190hereinafter. The blocking pattern 190 may block light that is providedfrom a lower portion of the first substrate 100 to a liquid crystal islayer.

The column spacer 195 is formed on the first substrate 100 formaintaining a cell gap between the first substrate 100 and the secondsubstrate 200. For example, the column spacer 195 is formed on the colorfilter layer 150 adjacent to an n-th data line. The column spacer 195 isformed from a material identical to the blocking pattern 190.

The second substrate 200 includes a common electrode 210 formed on asecond base substrate 201. The common electrode 210 may be formed on theentire surface of the second base substrate 201.

The liquid crystal layer 300 is interposed between the first substrate100 and the second substrate 200. The liquid crystal layer 300 includesliquid crystal molecules having positive dielectric anisotropy. Theliquid crystal molecules may be arranged such that a long axis of theliquid crystal molecules is substantially vertical to surfaces of thefirst and second substrates 100 and 200 when an electric field is notapplied to the liquid crystal layer.

The display panel according to the present exemplary embodiment mayinclude a first alignment layer AL1 (not shown) and a second alignmentlayer AL2 (not shown) formed on the first substrate 100 and the secondsubstrate 200, respectively.

The first substrate 100 having the first alignment layer AL1 formedthereon may further include a first reactive mesogen layer RML1. Theliquid crystal molecules may be pre-tilted by the first reactive mesogenlayer RML1 with respect to a vertical direction to the surfaces of thefirst and second substrates 100 and 200. A reactive mesogen that is amonomer is cured by light to form the first reactive mesogen layer RML1.

The second substrate 200 having the second alignment layer AL2 formedthereon may further include a second reactive mesogen layer RML2. Thesecond alignment layer AL2 and the second reactive mesogen layer RML2are substantially similar to the first alignment layer AL1 and the firstreactive mesogen layer RML1 except that both are formed on the secondsubstrate 200. Accordingly, further description will be omitted.

FIGS. 3A, 3B, 3C, 3D, 3E, 3F, and 3G are cross-sectional views showing aprocess for forming a first substrate of FIG. 2.

Referring to FIGS. 2 and 3A, the gate pattern is formed on the firstbase substrate 101. A gate metal is deposited on the first basesubstrate 101 formed from a glass via a sputtering process. The gatemetal is etched to form the first and second gate electrodes GE1 andGE2, which are extended from the first and second gate lines GL1 andGL2, respectively. The storage line STL is formed from a layer identicalto the first and second gate lines GL1 and GL2 on the first basesubstrate 101 and is formed from a material identical to the first andthe second gate lines GL1 and GL2.

The gate insulating layer 120 is formed on the first base substrate 101having the gate pattern formed thereon by a process of plasma enhancedchemical vapor deposition (PECVD). For example, the gate insulatinglayer 120 may include a material such as silicon nitride (SiN_(x)) orsilicon oxide (SiO_(x)). The gate insulating layer 120 has a thicknessof about 3000 Å.

Referring to FIGS. 2 and 3B, the active layer 130 and a source metallayer 135 are sequentially deposited on the first base substrate 101having the gate insulating layer 120 formed thereon. The active layer130 includes a semiconductor layer having amorphous silicon (s-Si:H) andan ohmic contact layer having amorphous silicon doped with n-typedopants (n+s-Si:H) formed on the semiconductor layer.

A photoresist pattern is formed on the first base substrate 101 havingthe source is metal layer 135 formed thereon. The photoresist patterncorresponds to the data line DLm, the source electrode, and the drainelectrode. The photoresist pattern is used to etch the source metallayer 135 so as to form a source pattern having the data line DLm, thesource electrode, and the drain electrode. In addition, a channel of theswitching element is formed by an etch-back process.

The passivation layer 140 is formed on the first base substrate 101having the source pattern formed thereon by a process of PECVD. Forexample, the passivation layer 140 may include materials such as siliconnitride (SiN_(x)). The passivation layer 140 has a thickness of about1000 Å.

Referring to FIGS. 2 and 3C, the color filter layer 150 is formed on thefirst base substrate 101 having the passivation layer 140 formedthereon. The color filter layer 150 is formed corresponding to the pixelarea. The color filter layer 150 may include a first color filter layer,a second color filter layer, and a third color filter layer. The firstcolor filter layer, the second color filter, and the third color filterlayer represent different colors. For example, the first color filterlayer, the second color filter layer, and the third color filter layerrepresent the colors red, blue, and green, respectively. The first, thesecond, and the third color filter layers may be disposed on each of thepixel areas in order along a first direction.

The inorganic insulating layer 160 is formed on the first base substrate101 having the color filter layer 150. The inorganic insulating layer160 may include a material such as silicon nitride (SiN_(x)) and has athickness of about 700 Å.

Referring to FIGS. 2 and 3D, the organic insulating layer 170 is formedon the first base substrate 101 having the inorganic insulating layer160 formed thereon. The organic insulating layer 170 includes an organicmaterial having a negative photoresist composed of, for example, anacrylic or a polyimide compound or composition.

A mask 10 is disposed to expose the organic insulating layer 170. Themask 10 includes a transparent substrate 11, a blocking part 12, and ahalf-transmitting part 13. The transparent substrate 11 transmits lightincludes a transparent material, for example, quartz. The blocking part12 includes a metal material, for example, chromium.

The blocking part 12 corresponds to the pixel area. Thehalf-transmitting part 13 corresponds to the boundary area of the pixelareas. In addition, the half-transmitting part 13 corresponds to theboundary area of the sub-pixel areas.

Ultraviolet (UV) light 1 irradiates the mask 10 to partially cure theorganic insulating layer 170 corresponding to the half-transmitting part13 so that a partial thickness of the organic insulating layer 170remains. The organic insulating layer 170 corresponding to the blockingpart 12 is not cured but is removed to form the organic insulatingpattern, but removing the organic insulating layer does not requireremoval of all traces of the organic insulating layer.

The first, the second, and the third contact holes CNT1, CNT2, and CNT3are formed through the passivation layer 140, the inorganic insulatinglayer 160, and the organic insulating pattern 170 corresponding to apixel unit. The first and second contact holes CNT1 and CNT2 expose aportion of the first and second drain electrodes DE1 and DE2. The thirdcontact hole CNT3 exposes a portion of the storage line STL. The firstand second contact holes CNT1 and CNT2 electrically contact with thefirst, the second, and the third drain electrodes DE1, DE2, and DE3 inwhich are input terminals of the first, the second, and the thirdswitching elements SW1, SW2, and SW3, respectively.

Alternatively, the organic insulating layer 170 may be patterned by adry-etching process, and may be removed by a slit mask.

Referring to FIGS. 2 and 3E, the pixel electrode 180 corresponding tothe each of pixel units is formed on the first base substrate 101 havingthe organic insulating pattern 170 having the first, the second, and thethird contact holes CNT1, CNT2, and CNT3 formed therethrough. The pixelelectrode 180 is formed from an optically transparent and electricallyconductive material. The pixel electrode 180 contacts the first andsecond drain electrodes DE1 and DE2 through the first and second contactholes CNT1 and CNT2. The pixel electrode 180 contacts the storage lineSTL through the third contact hole CNT3. The optically transparent andelectrically conductive material includes, for example, indium tin oxide(ITO) and indium zinc oxide (IZO).

Referring to FIGS. 2 and 3F, the blocking pattern 190 and the columnspacer 195 are formed on the first base substrate 101 having the pixelelectrode 180 formed thereon. The blocking pattern 190 is formed on theboundary area between adjacent pixel areas. The column spacer 195 isformed on the color filter layer 150 adjacent to an n-th data line. Theblocking pattern 190 and the column spacer 195 are simultaneously formedby using a same mask.

Referring to FIGS. 3 and 3G, the first base substrate 101 may includethe first alignment layer AL1 formed on the pixel electrode 180. Thefirst alignment layer AL1 arranges the liquid crystal composition of theliquid crystal layer 300 in a vertical direction with respect to thefirst base substrate 101. For example, the first alignment layer AL1 mayinclude polyimide material.

FIG. 4 is a cross-sectional view showing a process for forming a secondsubstrate of FIG. 2.

Referring to FIG. 4, the second substrate 200 includes the commonelectrode 210 formed on the second base substrate 201. The commonelectrode 210 may be formed on the is entire surface of the second basesubstrate 201.

The second base substrate 201 may include the second alignment layer AL2disposed on the common electrode 210. The second alignment layer AL2opposes the first alignment layer AL1 and arranges the liquid crystalcomposition in the vertical direction relative to the surface of thesecond substrate 200.

FIGS. 5A, 5B and 5C are cross-sectional views showing a process forforming the display panel of FIG. 2.

Referring to FIG. 5A, the first substrate 100 and the second substrate200 are combined to face to each other. The liquid crystal compositionis interposed between the first and second substrates 100 and 200 toform the liquid crystal layer 300. Alternatively, the liquid crystalcomposition may be dropped on the first substrate 100, and the firstsubstrate 100 and the second substrate 200 combined to interpose theliquid crystal layer 300 therebetween.

The liquid crystal composition of the display panel according to thepresent exemplary embodiment may further include a reactive mesogen 302.Examples of the reactive mesogen 302 is disclosed by U.S PatentApplication Publication No. 2008/0266503 A1, the contents of which arehereby incorporated by reference. The reactive mesogen 302 may includeat least one compound selected from the group consisting of thefollowing chemical formulae I, II, III, and IV shown below.

wherein R₁ and R₂ independently represent an acrylate group, a vinylgroup, or an epoxy group; Y represents —(CH₂)—, —O—, —CO—, —C(CF₃)₂—, ora single bond; X₁, X₂, X₃, and X₄ independently represent H or F; and nrepresents an integer ranging from 0 to 2.

The liquid crystal composition may range from about 0.05% by weight toabout 0.5% by weight of the reactive mesogen 302 based on a total weightof the liquid crystal composition. When the content of the reactivemesogen 302 is less than about 0.05% by weight, the reactive mesogenlayer may not be formed adjacent to the alignment layer of the displaypanel. When the content of the reactive mesogen 302 is greater thanabout 0.5% by weight, the reactive mesogen 302 may be cured by lightapplied from a backlight assembly (not shown) or by external light sothat a residual image may be created. Therefore, the liquid crystalcomposition may range from about 0.05% by weight to about 0.5% by weightof the reactive mesogen 302 based on a total weight of the liquidcrystal composition.

Referring to FIG. 5B, when a voltage is applied between the firstsubstrate 100 and the second substrate 200 to form an electric field,the liquid crystal molecules 301 and the reactive mesogen 302 tilt withrespect to the direction normal to the surfaces of the first substrate100 and the second substrate 200. Light irradiates the first substrate100 and the second substrate 200 while a voltage is applied,establishing an electric field therebetween. The light may be UVwavelengths. The reactive mesogen 320 is photopolymerized to be cured.The light intensity may range from about 3 J/cm² to about 10 J/cm² ofunpolarized UV radiation. When the light irradiates the liquid crystallayer 300, the liquid crystal molecules 301 may have a pretilt angle dueto the electric field. Light may continue to irradiate the liquidcrystal layer 300 after voltage is no longer applied to the firstsubstrate 100 and the second substrates 200. Therefore, residualreactive mesogen is transformed to reduce the amount of reactive mesogenremaining in the liquid crystal layer 300. For this, the intensity ofunpolarized UV may range from about 20 J/cm² to about 60 J/cm².

Referring to FIG. 5C, the first reactive mesogen layer RML1 is formed onthe first substrate 100, and the second reactive mesogen layer RML2 isformed on the second substrate 200 after irradiating the light. Thefirst reactive mesogen layer RML1 is formed on the first alignment layerAL1. The second reactive mesogen layer RML2 is formed on the secondalignment layer AL2. The liquid crystal molecules 301 are pre-tilted bythe first and second reactive mesogen layers RML1 and RML2. Therefore,the liquid crystal molecules 310 may obtain a pretilt angle by the firstand second reactive mesogen layers RML1 and RML2 while an electric fieldis not applied.

According to the present exemplary embodiment, the organic insulatinglayer corresponding to the pixel area is removed, and a height of theorganic insulating layer corresponding to the boundary area between thepixel areas is reduced. Therefore, deterioration of display quality byimpurities generated from the organic insulating layer may be minimized,and a stepped portion of a blocking pattern disposed between the pixelarea and the boundary area of the pixel area is reduced, preventingmotion blurring of a liquid crystal. Removal of the organic insulatinglayer does not require complete removal of the organic insulating layer.

FIG. 6 is a plan view showing a display panel according to anotherexemplary embodiment of the present invention. FIG. 7 is across-sectional view taken along a line II-II′ of the display panel ofFIG. 6.

The display panel according to the present exemplary embodiment issubstantially similar to the display panel of the previous exemplaryembodiment except that a boundary area is not formed between the firstsub-pixel electrode PE1 and the second sub-pixel electrode PE2, and thedisplay panel is driven by the first switching element SW1 and thesecond switching element SW2. Accordingly, the same reference numeralswill be used to refer to the same elements as those described above, anda detailed explanation will be omitted.

The display panel according to the present exemplary embodiment includesa first substrate 400, a second substrate 500, and a liquid crystallayer 600.

The first substrate 400 includes a gate line GLn, a data line DLm, astorage line STL, a first switching element SW1, a second switchingelement SW2, a gate insulating layer 420, an active layer 430, apassivation layer 440, a color filter layer 450, an inorganic insulatinglayer 460, an organic insulating pattern 470, a pixel electrode, ablocking pattern 490, and a column spacer 495; all are formed on thefirst base substrate 401. The switching element includes the firstswitching element SW1 and the second switching element SW2. The pixel iselectrode includes the first sub-pixel electrode PE1 and the secondsub-pixel electrode PE2.

The first switching element SW1 is adjacent to an area where the firstgate line GL1 and the first data line DL1 cross. The first gateelectrode GE1 of the first switching element SW1 is connected to thefirst gate line GL1. The first source electrode SE1 is connected to thefirst data line DL1. The first pixel electrode PE1 is electricallyconnected to the first drain electrode DE1 through the first contacthole CNT1.

The second switching elements SW2 is adjacent to an area where the firstgate line GL1 and the first data line DL1 cross. The second gateelectrode GE2 is connected to the first gate line GL1. The second sourceelectrode SE2 of the second switching element SW2 is connected to thesecond data line DL2. The second drain electrode DE2 is electricallyconnected to the second sub-pixel electrode PE2 through the secondcontact hole CNT2.

The first switching element SW1 and the second switching element SW2 areturned on in response to a first gate signal applied to the first gateline GL1. An area having the first sub-pixel electrode PE1 may bedefined as a high pixel of the display panel. An area having the secondsub-pixel electrode PE2 may be defined as a low pixel of the displaypanel.

The second substrate 500 includes the common electrode 510 formed on thesecond base substrate 501. The common electrode 510 may be formed on theentire surface of the second base substrate 501.

The liquid crystal layer 600 is interposed between the first substrate400 and the second substrate 500. The liquid crystal layer 600 includesliquid crystal molecules having a positive dielectric anisotropy. Theliquid crystal molecules may be arranged such that the long axis of theliquid crystal molecules is substantially vertical to the surfaces ofthe first substrate 400 and the second substrate 500 when an electricfield is not applied to the liquid crystal layer.

FIGS. 8A, 8B, and 8C are cross-sectional views showing a process forforming a first substrate of FIG. 7.

Referring to FIG. 8A, the gate pattern having the gate electrode GE1 andthe gate line, the gate insulating layer 420, the active layer 430, andthe source pattern having the source electrode and the first drainelectrode DE1 are sequentially deposited on the first base substrate 401to form the first switching element SW1. The passivation layer 440 isformed on the first base substrate 401 having the first switchingelement SW1 formed thereon. The color filter layer 450 corresponding tothe pixel area is formed on the first base substrate 401 having thepassivation layer 440 formed thereon.

Referring to FIG. 8B, the inorganic insulating layer 460 and the organicinsulating layer 470 are sequentially formed on the first base substrate401 having the color filter layer 450 formed thereon. The organicinsulating layer 470 corresponding to the pixel area is removed by, forexample, UV exposure 1, and the organic insulating layer 470corresponding to the boundary area of the pixel area is partiallyremoved by UV exposure 1 to form the organic insulating pattern 470.Removing the organic insulating layer does not require complete removal,and some residue of the organic insulating layer may remain. The firstcontact hole CNT1 is formed through the organic insulating pattern 470.The pixel electrode 480 is electrically connected to the drain electrodeDE1 through the first contact hole CNT1.

Referring to FIG. 8C, the pixel electrode 480 is formed on the firstbase substrate 401 having the organic insulating pattern 470 formedthereon. The blocking pattern 490 and the column spacer 495 aresimultaneously formed on the first base substrate 401 having the pixelelectrode 480 by using a same mask. The process forming the secondsubstrate 500 and the liquid crystal layer 600 of the display panel inthis embodiment is substantially similar to the is process forming thedisplay panel according to the previous exemplary embodiment.Accordingly, a detailed explanation will be omitted.

According to the present exemplary embodiment, the organic insulatinglayer corresponding to the pixel area is removed, and a height of theorganic insulating layer corresponding to the boundary area between thepixel areas is reduced. Therefore, deterioration of display quality byimpurities generated from the organic insulating layer may be minimized,and a stepped portion of a blocking pattern disposed between the pixelarea and the boundary area of the pixel area is reduced so that motionblurring of a liquid crystal may be prevented.

FIG. 9 is a cross-sectional view showing a display panel according toanother exemplary embodiment of the present invention.

The display panel according to the present exemplary embodiment issubstantially similar to the display panel described in FIG. 1 exceptthat the organic insulating layer is formed on the entire surface of thedisplay substrate, and the inorganic insulating layer is not formed onthe color filter layer so a detailed explanation will be omitted.

The display panel according to the present exemplary embodiment includesthe first substrate 700, the second substrate 800 and the liquid crystallayer 900.

The first substrate 700 includes the gate line GLn, the data line DLm,the storage line STL, the first switching element SW1, the secondswitching element SW2, the third switching element SW3, the gateinsulating layer 720, the active layer 730, the passivation layer 740,the color filter layer 750, the organic insulating layer 770, the pixelelectrode, the blocking pattern 790, the column spacer 795, and thefirst reactive mesogen layer RML1, all of which are formed on the firstbase substrate 701.

Referring to FIG. 9, the organic insulating layer 770 is formed on theentire is surface of the first base substrate 701 having the switchingelement and the color filter layer 750. The organic insulating layer 770includes silicon nitride (SiN_(x)). The pixel electrode 780, theblocking pattern 790, and the column spacer 795 are formed by a processidentical to a process for forming the display panel described in FIG.1.

The second substrate 800 includes the common electrode 810 and thesecond reactive mesogen layer RML2 formed on the second base substrate801. The common electrode 810 may be formed on the entire surface of thesecond base substrate 801.

The liquid crystal layer 900 is interposed between the first substrate700 and the second substrate 800. The liquid crystal composition may bedropped on the first substrate 700, and the first substrate 700 and thesecond substrate 800 combined to interpose the liquid crystal layer 900therebetween.

The liquid crystal composition of the display panel according to thepresent exemplary embodiment may include a reactive mesogen having atleast one compound selected from the group consisting of compoundsrepresented by the chemical formulae I, II, III, and IV. The liquidcrystal composition may range from about 0.05% by weight to about 0.5%by weight of the reactive mesogen based on a total weight of the liquidcrystal composition.

FIGS. 10A and 10B are cross-sectional views showing a process forforming a first substrate of FIG. 9.

Referring to FIG. 10A, the gate pattern having the first gate electrodeGE1 and the first gate line GL1, the gate insulating layer 720, theactive layer 730, and the source pattern having the first sourceelectrode SE1 and the first drain electrode DE1, the passivation layer740, the color filter layer 750, and the organic insulating layer 770are sequentially formed on the first base substrate 701.

Referring to FIG. 10B, the contact hole (not shown) is formed throughthe organic insulating layer 770. The pixel electrode 780 is formed onthe organic insulating layer 770 having the contact hole formedtherethrough. The blocking pattern 790 and the column spacer 795 aresimultaneously formed on the first base substrate 701 having the pixelelectrode 780 by using a same mask.

The process forming the second substrate 800 and the liquid crystallayer 900 of the display panel in the present exemplary embodiment issubstantially similar to the process for forming the display paneldescribed in FIG. 1 so a detailed explanation will be omitted.

FIG. 11 is a cross-sectional view illustrating a display panel accordingto another exemplary embodiment of the present invention.

The display panel according to the present exemplary embodiment issubstantially similar to the display panel described in FIG. 6 exceptthat the organic insulating layer is formed on the entire surface of thedisplay substrate, and the inorganic insulating layer is not formed onthe color filter layer.

The display panel according to the present exemplary embodiment includesthe first substrate 1100, the second substrate 1200, and the liquidcrystal layer 1300.

The first substrate 1100 includes the gate line GLn, the data line DLm,the storage line STL, the first switching element SW1, the secondswitching element SW2, the gate insulating layer 1120, the active layer1130, the passivation layer 1140, the color filter layer 1150, theorganic insulating layer 1170, the pixel electrode, the blocking pattern1190, the column spacer 1195, and the first reactive mesogen layer RML1;all are formed on the first base substrate 1101.

Referring to FIG. 11, the organic insulating layer 1170 is formed on theentire is surface of the first base substrate 1101 having the switchingelement SW and the color filter layer 1150. The organic insulating layer1170 may include materials such as silicon nitride (SiN_(x)). The pixelelectrode 1180, the blocking pattern 1190, and the column spacer 1195are formed by a process identical to the process for forming the displaypanel described in FIG. 6.

The second substrate 1200 includes the common electrode 1210 formed onthe second base substrate 1201. The common electrode 1210 may be formedon the entire surface of the second base substrate 1201.

The liquid crystal layer 1300 is interposed between the first substrate1100 and the second substrate 1200. The liquid crystal composition maybe dropped on the first substrate 1100, and the first substrate 1100 andthe second substrate 1200 are combined to form the liquid crystal layer1300.

The liquid crystal composition of the display panel according to thepresent exemplary embodiment may include a reactive mesogen having atleast one compound selected from the group consisting of compoundsrepresented by the chemical formulae I, II, III, and IV. The liquidcrystal composition may range from about 0.05% by weight to about 0.5%by weight of the reactive mesogen based on a total weight of the liquidcrystal composition.

FIGS. 12A and 12B are cross-sectional views showing a process forforming a first substrate of FIG. 11.

Referring to FIG. 12A, the gate pattern having the first gate electrodeGE1 and the gate line, the gate insulating layer 1120, the active layer1130, and the source pattern having the source electrode and the firstdrain electrode DE1 are sequentially formed on the first base substrate1101 to form the first switching element SW1. The passivation layer1140, the color filter layer 1150, and the organic insulating layer 1170are sequentially formed on the first base is substrate 1101 having thefirst switching element SW1.

Referring to FIG. 12B, the first contact hole is formed through theorganic insulating layer 1170. The pixel electrode 1180 is formed on theorganic insulating layer 1170 having the first contact hole CNT1 formedtherethrough. The blocking pattern 1190 and the column spacer 1195 aresimultaneously formed on the first base substrate 1101 having the pixelelectrode 1180 by using a same mask.

The process forming the second substrate 1200 and the liquid crystallayer 1300 of the display panel in this embodiment is substantiallysimilar to the process for forming the display panel described in FIG.6. Accordingly, any detailed explanation will be omitted.

According to exemplary embodiments of the present invention, an organicinsulating layer corresponding to the pixel area is removed (but notnecessarily totally removed) so that deterioration of display quality byimpurities generated from the organic insulating layer may be minimized.In addition, a stepped portion of a blocking pattern disposed between apixel area and a boundary area of a plurality of the pixel areas isreduced so that motion blurring of a liquid crystal may be prevented.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present inventionwithout departing from the spirit or scope of the invention. Thus, it isintended that the present invention covers the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

1. A method of manufacturing a display substrate, the method comprising:forming a color filter layer on a substrate and within a pixel area, thesubstrate comprising a switching element; forming an organic insulatinglayer on the substrate comprising the color filter layer; forming afirst organic insulating pattern by removing the organic insulatinglayer from an area corresponding to the color filter layer and removinga partial thickness of the organic insulating layer from a firstboundary area in the pixel area; forming a pixel electrode on thesubstrate, the pixel electrode being electrically connected to theswitching element; forming a first blocking pattern on the first organicinsulating pattern; and forming a column spacer on the color filterlayer.
 2. The method of claim 1, further comprising: forming aninorganic insulating layer on the base substrate after disposing thecolor filter layer on the base substrate and before forming the firstorganic insulating pattern.
 3. The method of claim 1, wherein formingthe pixel electrode further comprises: forming a first sub-pixelelectrode in a first sub-pixel area of the pixel area; and forming asecond sub-pixel electrode in a second sub-pixel area of the pixel area.4. The method of claim 3, further comprising: forming a second organicinsulating pattern on the substrate and in a second boundary area; andforming a second blocking pattern on the second organic insulatingpattern, wherein the switching element is disposed in the secondboundary area located between the first sub-pixel electrode and thesecond sub-pixel electrode.
 5. The method of claim 4, wherein theinorganic insulating layer is disposed between the second organicinsulating pattern and the substrate.
 6. The method of claim 1, furthercomprising: forming a reactive mesogen layer on the substrate comprisingthe pixel electrode.
 7. The method of claim 6, wherein forming thereactive mesogen layer comprises: irradiating a liquid crystalcomposition with light, the liquid crystal composition comprising areactive mesogen, wherein the reactive mesogen comprises at least onecompound selected from the group consisting of

wherein R1 and R2 independently represent an acrylate group, a vinylgroup, or an epoxy group; Y represents —(CH2)—, —O—, —CO—, —C(CF3)2-, ora single bond; X1, X2, X3 and X4 independently represent H or F; and nrepresents an integer ranging from 0 to
 2. 8. A method of manufacturinga display panel, the method comprising: forming a color filter layerwithin pixel areas of a first substrate, the first substrate comprisingswitching elements; forming an organic insulating layer on thesubstrate; forming a first organic insulating pattern by removing theorganic insulating layer from an area corresponding to the color filterlayer and reducing the thickness of the organic insulating layer at aboundary area between the pixel areas; forming pixel electrodes on thefirst substrate, the pixel electrodes being electrically connected tothe switching elements; and forming a first blocking pattern on thefirst organic insulating pattern; coupling a second substrate to thefirst substrate, the second substrate comprising a common electrodedisposed on a second base substrate; and interposing a liquid crystalcomposition between the first substrate and the second substrate.
 9. Themethod of claim 8, further comprising irradiating the first substrateand the second substrate with light to form a first reactive mesogenlayer on the first substrate and a second reactive mesogen layer on thesecond substrate, wherein the liquid crystal composition comprises areactive mesogen comprising at least one compound selected from thegroup consisting of:

wherein R1 and R2 independently represent an acrylate group, a vinylgroup, or an epoxy group; Y represents —(CH2)—, —O—, —CO—, —C(CF3)-, ora single bond; X1, X2, X3, and X4 independently represent H or F; and nrepresents an integer ranging from 0 to
 2. 10. The method of claim 9,wherein the reactive mesogen ranges from 0.05 percent by weight to 0.5percent by weight based on the total weight of the liquid crystalcomposition.
 11. The method of claim 9, further comprising: providingpretilt angles of the liquid crystal composition by irradiating theliquid crystal composition with unpolarized ultraviolet light rangingfrom 3 J/cm2 to 10 J/cm2 with an electric field applied to the displaypanel and subsequently irradiating the liquid crystal composition withunpolarized ultraviolet light ranging from 20 J/cm2 to 60 J/cm2 withoutan electric field applied to the display panel.
 12. The method of claim9, wherein: the color filter layer is formed on the first substratewithin the pixel areas after the switching elements are formed on thefirst substrate; the organic insulating layer is formed on the firstsubstrate after forming the color filter, the organic insulating layercomprising a negative photoresist material; the pixel electrodes areformed on the pixel areas; and the blocking pattern and column spacersare formed on the boundary area and between adjacent pixel electrodes.